Memory sub-system including an in-package sequencer to perform error correction and memory testing operations

ABSTRACT

A processing device of a sequencer component can receive data from a controller that is external to the sequencer component. The processing device of the sequencer component can perform an error correction operation on the data received from the controller that is external to the sequencer component to generate a code word associated with the data. The code word can be stored at a memory component coupled with the sequencer component.

TECHNICAL FIELD

Embodiments of the disclosure relate generally to memory sub-systems,and more specifically, relate to a memory sub-system including anin-package sequencer to perform error correction and memory testingoperations.

BACKGROUND

A memory sub-system can be a storage system, such as a solid-state drive(SSD), or a hard disk drive (HDD). A memory sub-system can be a memorymodule, such as a dual in-line memory module (DIMM), a small outlineDIMM (SO-DIMM), or a non-volatile dual in-line memory module (NVDIMM). Amemory sub-system can include one or more memory components that storedata. A memory sub-system can include one or more memory components thatstore data. The memory components can be, for example, non-volatilememory components and volatile memory components. In general, a hostsystem can utilize a memory sub-system to store data at the memorycomponents and to retrieve data from the memory components.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will be understood more fully from the detaileddescription given below and from the accompanying drawings of variousembodiments of the disclosure.

FIG. 1 illustrates an example computing environment that includes amemory sub-system in accordance with some embodiments of the presentdisclosure.

FIG. 2 is a flow diagram of an example method for performing an encodingerror correction operation on data in accordance with some embodimentsof the present disclosure.

FIG. 3 is a flow diagram of an example method for performing a decodingerror correction operation on data in accordance with some embodimentsof the present disclosure.

FIG. 4 is a flow diagram of an example method for performing a test of amemory component in accordance with some embodiments of the presentdisclosure.

FIG. 5 is a block diagram of an example computer system in whichembodiments of the present disclosure may operate.

DETAILED DESCRIPTION

Aspects of the present disclosure are directed to a memory sub-systemincluding an in package sequencer component to perform error correctionand memory testing operations. A memory sub-system is also hereinafterreferred to as a “memory device”. An example of a memory sub-system is astorage device that is coupled to a central processing unit (CPU) via aperipheral interconnect (e.g., an input/output bus, a storage areanetwork). Examples of storage devices include a solid-state drive (SSD),a flash drive, a universal serial bus (USB) flash drive, and a hard diskdrive (HDD). Another example of a memory sub-system is a memory modulethat is coupled to the CPU via a memory bus. Examples of memory modulesinclude a dual in-line memory module (DIMM), a small outline DIMM(SO-DIMM), a non-volatile dual in-line memory module (NVDIMM), etc. Insome embodiments, the memory sub-system is a hybrid memory/storagesub-system. In general, a host system can utilize a memory sub-systemthat includes one or more memory components. The host system can providedata to be stored at the memory sub-system and can request data to beretrieved from the memory sub-system.

The memory sub-system can include multiple memory components that canstore data from the host system. Each memory component can include adifferent type of media. Examples of media include, but are not limitedto, a cross-point array of non-volatile memory and flash based memorysuch as single-level cell (SLC) memory, triple-level cell (TLC) memory,and quad-level cell (QLC) memory. The characteristics of different typesof media can be different from one media type to another media type. Oneexample of a characteristic associated with a memory component is datadensity. Data density corresponds to an amount of data (e.g., bits ofdata) that can be stored per memory cell of a memory component. Anotherexample of a characteristic of a memory component is access speed, whichcorresponds to an amount of time for the memory component to access datastored at the memory component.

A memory sub-system can also include a controller operatively coupled tothe memory components. The controller can operate as a “bridge” betweena host system and memory components of the memory sub-system for datatransmission and/or management. In some instances, the controller andthe associated memory components can be manufactured by differentvendors and each of the controller and/or memory components can have arespective package. To increase the capacity of the memory sub-system,memory components can be added to the memory sub-system and thecontroller can interface with the multiple memory components. Inconventional systems, a controller can include a large number of pins tointerface with the memory components when a parallel interface is usedbetween the controller and the memory components. Including a largenumber of pins can increase package size of the controller, which can inturn increase the form factor of the conventional system.

In some conventional systems, the controller interfaces with the hostsystem using a Serializer/Deserializer (SerDes) connection (e.g., SerialAdvanced Technology Attachment (SATA), Universal Serial Bus (USB),Peripheral Component Interconnect Express (PCIe), Universal FlashStorage (UFS), etc.) to minimize pin count. Conventional controllers caninclude a sequencer component that uses a protocol and timingrequirements (e.g., read/write latency, etc.) specific to the memorytype of the memory components to interface with and instruct the memorycomponents. The controller can interface with memory components via aparallel interface utilizing Double Data Rate (DDR) to obtain a certainbandwidth and capacity. Increasing the number of memory components thatinterface directly with a controller can use more space and causedifficulty when routing the parallel interfaces. As a result, therouting paths (e.g., traces) between the controller and the memorycomponents can be long, thereby compromising signal integrity. Further,using longer routing paths to the memory components via the parallelinterface can cause loads to be larger, thereby consuming undesirableamounts of power.

Additionally, to improve the reliability of data stored in a memorysub-system, some conventional controllers can perform error correctionoperations. An error correction operation can refer to any suitabletechnique for correcting one or more errors in data, such as errorcorrection codes, redundancy operations, etc.

The error correction operations use parameters specific to the memorytype of the memory components coupled to a conventional controller. Theparameters can be used to configure a size of the code word based ontype of the memory component, for example. When a new generation ofmemory component is added to the memory sub-system to expand thecapacity of the memory sub-system, the firmware of the controller istypically updated with new parameters of the memory type of the newgeneration memory component. The controller can be shutdown to beupdated, thereby causing processing downtime. When the controller isbeing updated, the memory system can experience throughput issuesbecause the controller is not performing the error correctionoperations. Also, the controller can read and reread data from a memorycomponent that stores a code word when attempting to decode the codeword. The data can be sent across the parallel interface between thecontroller and the memory component, which can use an undesirable amountof power and/or affect data integrity due to the length of the trace.

Further, conventionally, when memory components are tested, the memorycomponents can be coupled to a testing board that performs one or moretests on the memory components. Each memory type of the memorycomponents can have different testing requirements. Thus, there can bedifferent testing boards that are dedicated to testing particular typesof memory components. The cost of testing the memory components usingdedicated testing boards can be undesirably high. Further, for somenewer memory components, there may not be a testing board developed totest the newer memory components.

Aspects of the present disclosure address the above and otherdeficiencies by separating the sequencer component from the controllerand including the sequencer component with one or more memory componentsin an individual package. The sequencer component can perform errorcorrection operations and/or memory testing operations. The sequencercomponent can be manufactured in an independent silicon, the memorycomponents can be manufactured in independent die, and the independentsilicon and the independent die can be included in the same package. Apackage can refer to a case that supports electrical contacts whichconnect the package to an application board and that prevents physicaldamage and corrosion. The application board can refer to a printedcircuit board on which the controller, the package, and/or the memorycomponents reside. Each sequencer component operates with a certain type(e.g., cross-point array, NAND flash, etc.) of memory component and canoperate with multiple memory components having that type of memory. Thesequencer component can interface with the memory components via aprotocol specific to the memory type. Each package can include multiplesequencer components interfacing with respective differing types ofmemory components. Further, the memory sub-system can include multiplepackages each including one or more sequencer components interfacingwith one or more memory components.

The sequencer component can interface with the controller via a SerDesconnection that provides higher bandwidth than a parallel interface.Further, SerDes connections use less pins than parallel connections.Thus, the pin count in the controller can be reduced using the disclosedtechniques, while still accommodating the same number or more memorycomponents included in the packages coupled to the controller. Reducingthe pin count of the controller can result in a reduced form factor forthe memory sub-system that includes the same capacity (e.g., same numberof memory components) as previous conventional systems that includedmore pins.

Further, signal integrity can be improved because the distance betweenthe sequencer component and the memory components within an independentpackage is shorter than the distance between the sequencer component andthe memory components in conventional systems where the sequencercomponent is within the controller. That is, the package is smaller thanan application board, and thus, the trace between the sequencercomponent and the memory components within the package is shorter thanconventional systems where the trace runs on the application board. Theshorter traces can improve the signal integrity, as well as reduce theload on the package and consume less power than conventional systemswhere the routing paths are longer.

In some embodiments, the sequencer component can perform errorcorrection operations. For example, the sequencer component can includea processing device that executes an error correction engine. The errorcorrection engine can include an encoder and a decoder that perform anencoding error correction operation and a decoding error correctionoperation, respectively. The error correction engine can be programmedto perform the error correction operations based on the memory type ofthe memory components to which the sequencer component is attached.Performing at least some of the error correction operations at thesequencer component can reduce complexity at the controller because thecontroller does not have to manage all of the different error correctioncode parameters associated with the different memory types of memorycomponents in the memory sub-system. Further, the consumption of powercan be decreased and data signal integrity can be improved by reducingthe traffic of data over the connection between the controller and thesequencer component because the sequencer component can perform theerror correction operations locally in the package and send the decodeddata to the controller. That is, in some embodiments, the sequencercomponent performing at least some of error correction operations canreduce the traffic of data sent across the connection between thecontroller and the sequencer component.

In some embodiments, the sequencer component can iteratively performerror correction operations until errors are corrected in data read fromthe one or more memory components. For example, a first error correctionoperation can be performed to correct at least one error in the data,and another error correction operation can be performed on the modifieddata to correct another error. Such an embodiment can enhanceperformance of the memory sub-system because the multiple datatransmissions between the memory components and the sequencer componentsduring error correction are faster using the shorter traces in thepackage, as opposed to using the longer traces between the memorycomponents and the controller in conventional memory systems. Also, insome embodiments, the sequencer component can perform a first level ofone or more error correction operations that corrects one or more errorsincluded in data read from the one or more memory components, and thecontroller can perform a second level of one or more error correctionoperations to correct additional (e.g., remaining) errors included inthe data. Such an embodiment can also enhance performance by correctinga majority of errors at the sequencer component, thereby reducing thenumber of back and forth transmissions between the controller and thememory components in conventional memory systems.

In some embodiments, the sequencer component can transmit a notificationto the controller that indicates that the sequencer component includeserror correction functionality. This notification can cause thecontroller to send raw data received from the host to the sequencercomponent without performing an encoding error correction operation onthe raw data. In such an instance, the sequencer component can receivethe raw data and encode the raw data to generate a code word based onthe memory type of the memory components in the package. Also, if thesequencer component indicates that the sequencer component does not haveerror correction functionality or does not provide the notificationindicating that the sequencer component includes error correctionfunctionality, the controller can perform the error correctionoperations for any data associated with the memory components coupled tothat sequencer component. In another example, the controller can querythe sequencer component to determine whether the sequencer has errorcorrection functionality. If not, the controller can perform the errorcorrection operations for any data associated with the memory componentscoupled to that sequencer component.

Additionally, in some embodiments, the sequencer component can alsoinclude a memory test engine to perform one or more tests on the memorycomponents coupled to the sequencer component. Including the memory testengine and performing memory tests within the sequencer component canreduce the cost associated with testing the memory components. Further,the memory test engine can be updated to perform tests specific to thetype of memory components that are coupled to the sequencer component,thereby enabling testing new memory component types that lack testingboards. The memory test engine can include a testing pattern generatorand a comparator. The testing pattern generator can generate a testingpattern that corresponds to operations to read and/or write data to theone or more memory components. The testing pattern generator cangenerate the data to be written to the one or more memory components.The testing pattern can simulate certain operational conditions, such asperforming numerous writes to determine whether the memory component canfunction properly at certain temperatures. Further, the testing patterncan stress test timing requirements for transmitting signals from thesequencer component to the memory component over the interface betweenthe sequencer component and the memory component. The test can beperformed utilizing different voltages to determine whether the memorycomponent writes and/or reads data properly under different voltages.Further, the memory test engine can program memory parameters, such asread voltage levels to increase the quality of reading data during thetests.

The testing pattern can be based on the memory type of the one or morememory components. For example, there can be known interfacing issues ondifferent memory types so the testing pattern can include certain readand/or write patterns to screen out defects in the particular memorytypes. The testing pattern generator can be programmable by a testengineer. In some embodiments, the testing pattern can be already storedin a memory accessible to the memory test engine and/or can be receivedfrom another component and/or device.

After the testing pattern is performed to read and/or write data, thecomparator can be used to determine whether data read from the one ormore memory components is what is expected for a particular test bycomparing the data retrieved from the one or more memory components tothe data written to the one or more memory components. If the test issuccessful, the retrieved and written data should match and anotification can be transmitted indicating the same. If the test isunsuccessful, the retrieved and written data should not match and anotification can be transmitted indicating the same.

Some advantages of the present disclosure include enhancing performanceof the memory sub-system by performing error correction operations atthe sequencer and reducing the number of transmissions between thememory controller and the memory components. Further, power consumptioncan be reduced by performing error correction operations at thesequencer because the data read by the sequencer during the errorcorrection operation is transmitted between the sequencer and the memorycomponent over a short trace. This can improve the signal integrity byusing the short trace between the sequencer and the memory component toperform the error correction operations, which can improve the qualityof correcting any errors if there are not errors introduced in the dataduring transmission. Additional advantages can include reducing cost oftesting the memory components by including the memory test engine in thesequencer.

FIG. 1 illustrates an example computing environment 100 that includes amemory sub-system 110 in accordance with some embodiments of the presentdisclosure. The memory sub-system 110 can include media, such as memorycomponents 112. The memory components 112 can be volatile memorycomponents, non-volatile memory components, or a combination of such. Insome embodiments, the memory sub-system is a storage system. An exampleof a storage system is a SSD. In some embodiments, the memory sub-system110 is a hybrid memory/storage sub-system.

In some embodiments, the memory components 112 can be included in apackage 130. There may be numerous packages (represented by ellipsis131) that each include one or more respective memory components. Asdepicted, the memory components 112A to 112N are coupled to a sequencercomponent 140 in the package 130A. It should be understood that therecan be numerous sequencer components included in the package 130, andeach sequencer component can be coupled to one or more respective memorycomponents. Each of the sequencer components 140 can be manufactured inindependent silicon and each of the memory components 112 can bemanufactured in independent die. The memory sub-system 110 can include amemory system controller 115 (hereinafter referred to as “controller”).The sequencer component 140 and memory components 112 can be included ina single package 130 and coupled via short traces 162 to improveperformance of issuing commands from the sequencer component 140 to thememory components 112. Power load consumption can be reduced and datasignal integrity can be increased by using shorter traces between thesequencer component 140 and the memory components as opposed toconventional arrangements. Also, as discussed herein, moving thesequencer component 140 to a package 130 separate from the controller115 can provide numerous other benefits, such as reducing the formfactor of the memory sub-system 110, increasing bandwidth between thecontroller 115 and the memory components 112, and so forth.

For example, the sequencer component 140 and memory components 112 inthe packages 130 can be coupled to the controller 115 via a SerDesinterface 160, as opposed to a parallel interface. A SerDes interface160 provides higher bandwidth than a parallel interface, and also usesless outgoing pins, thereby reducing the number of pins needed for thecontroller 115 to provide a memory sub-system 110 with the same capacity(e.g., number of memory components 112). For instance, a SerDesinterface can use six pins (e.g., two for clock, two for transmit, twofor receive), whereas a parallel interface can use more than twenty pinsto operate. Reducing the outgoing pin count of the controller 115 canimprove the form factor of the entire memory sub-system 110 by reducingthe size of the controller 110. Further, removing the sequencercomponent 140 from the controller 115 can also reduce the size of thecontroller 115.

The sequencer component 140 can perform one or more operations and canbe configured based on the type of memory component 112 to which arespective sequencer component is coupled. For example, the sequencercomponent 140 can include an error correction engine 141, a memory testengine 145, and a protocol engine 150. The error correction engine 141can perform one or more error correction operations to encode datareceived from the controller 115 and/or decode data read from the memorycomponents 112A. Accordingly, the error correction engine 141 caninclude an encoder 142 and a decoder 143. The decoding error correctionoperations can use any suitable error correction technique, such aserror correction codes, redundancy operations (e.g., XOR), etc. Errorcorrection codes can be used to improve the reliability of data storedin the memory sub-system 110. An error correction code can refer to atechnique for expressing a sequence of data to enable errors introducedto the data to be detected and corrected based on the other remainingdata. The sequence of data can be referred to as code words. Types oferror correction codes can include block codes (e.g., Hamming codes,Reed Solomon codes, etc.). The redundancy operation can refer to using alogical operation (e.g., XOR) to reconstruct the data. The redundancyreconstruction operation uses information of the exact error locationsand the number of known error locations does not exceed a threshold.

Using the shorter traces in the package 130 can improve the performanceof the error correction process, thereby enhancing overall performanceof the memory sub-system. Further, in some embodiments, the controllerdoes not need to manage the various error correction parameters for thememory type of the memory components 112 because the respectivesequencer component of each package can manage the parameters for theirrespective memory components 112 instead.

In addition, the sequencer component 140 can include a memory testengine 145 to perform one or more tests on the memory components 112.The tests can be tailored to ensure the memory components 112 arecompatible with the controller 115. The memory test engine 145 includesa testing pattern generator 146 and a comparator 147. The testingpattern generator 146 can generate a testing pattern to test the memorycomponents 112. The testing pattern can correspond to operations (e.g.,read and/or write) associated with generated data to be performed on thememory components 112. The tests can stress test the memory components112 by using a testing pattern to test the operation of the memorycomponents 112 under various temperatures. Additionally, the testingpattern can test a timing window of when data signals associated withthe memory components 112 are sent and/or received. The test can ensurethat the memory components 112 satisfy timing requirements oftransmitting signals via an interface between the memory components 112and the sequencer component 140. The testing pattern generator 146 cancause different voltages to be applied throughout the test to determinewhether the memory components 112 function properly (e.g., store correctdata) when different voltages are applied. Also, since differing memorytypes (e.g., cross-point array, flash, etc.) can be associated withdiffering read voltage levels, the testing pattern generator 146 canprogram memory parameters such as the read voltage level to enhance thequality of data read from the particular memory type of the memorycomponents 112.

After the test completes, the comparator 147 can compare data read fromthe memory components 112 with the data associated with the testingpattern that was written to the memory components 112 during the test.If the data is as expected (e.g., the read data matches the datawritten), then the comparator 147 can determine that the test completedsuccessfully and can provide a notification indicating the same. If thedata is not as expected (e.g., the read data does not match the datawritten), then the comparator 147 can determine that the test did notcomplete successfully and can provide a notification indicating thesame.

The sequencer component 140 can also perform other operations using aprotocol engine 150. For example, the protocol engine 150 can attempt tomaximize interface bandwidth between the memory components 112 and thesequencer component 140 by enforcing the timing requirements for thememory type of the memory components 112. Timing requirements can relateto latency of read/write operations performed for the memory type. Theprotocol engine 150 can time when to issue the read/write commands basedon the latencies for the types of the memory components 112. Further,the protocol engine 150 can reorder commands based on certain rulesrelated to the commands and addresses involved in the commands. That is,the protocol engine 150 can reorder read/write requests by consideringrules that ensure data coherency. For example, if there is a writerequest and then a read request to the same address, a rule can dictatethat the read request cannot be moved prior to the write request becausethe read request would return old data. Thus, the protocol engine 150can reorder operations and enforce the timing of when to transmit theoperations to the memory components 112 based on the bandwidth of thememory components 112.

In general, the computing environment 100 can include a host system 120that uses the memory sub-system 110. For example, the host system 120can write data to the memory sub-system 110 and read data from thememory sub-system 110. The host system 120 can be a computing devicesuch as a desktop computer, laptop computer, network server, mobiledevice, or such computing device that includes a memory and a processingdevice. The host system 120 can include or be coupled to the memorysub-system 110 so that the host system 120 can read data from or writedata to the memory sub-system 110. The host system 120 can be coupled tothe memory sub-system 110 via a physical host interface. As used herein,“coupled to” generally refers to a connection between components, whichcan be an indirect communicative connection or direct communicativeconnection (e.g., without intervening components), whether wired orwireless, including connections such as electrical, optical, magnetic,etc. Examples of a physical host interface include, but are not limitedto, a Serial/Deserial (SerDes) interface, a serial advanced technologyattachment (SATA) interface, a peripheral component interconnect express(PCIe) interface, universal serial bus (USB) interface, Fibre Channel,Serial Attached SCSI (SAS), etc. The physical host interface can be usedto transmit data between the host system 120 and the memory sub-system110. The host system 120 can further utilize an NVM Express (NVMe)interface to access the memory components 112A to 112N when the memorysub-system 110 is coupled with the host system 120 by the PCIeinterface. The physical host interface can provide an interface forpassing control, address, data, and other signals between the memorysub-system 110 and the host system 120.

The memory components 112 can include any combination of the differenttypes of non-volatile memory components and/or volatile memorycomponents. An example of non-volatile memory components includes anegative-and (NAND) type flash memory. Each of the memory components 112can include one or more arrays of memory cells such as single levelcells (SLCs) or multi-level cells (MLCs) (e.g., triple level cells(TLCs) or quad-level cells (QLCs)). In some embodiments, a particularmemory component can include both an SLC portion and a MLC portion ofmemory cells. Each of the memory cells can store one or more bits ofdata (e.g., data blocks) used by the host system 120. Althoughnon-volatile memory components such as NAND type flash memory aredescribed, the memory components 112 can be based on any other type ofmemory such as a volatile memory. In some embodiments, the memorycomponents 112 can be, but are not limited to, random access memory(RAM), read-only memory (ROM), dynamic random access memory (DRAM),synchronous dynamic random access memory (SDRAM), phase change memory(PCM), magneto random access memory (MRAM), negative-or (NOR) flashmemory, electrically erasable programmable read-only memory (EEPROM),and a cross-point array of non-volatile memory cells. A cross-pointarray of non-volatile memory can perform bit storage based on a changeof bulk resistance, in conjunction with a stackable cross-gridded dataaccess array. Additionally, in contrast to many flash-based memories,cross-point non-volatile memory can perform a write in-place operation,where a non-volatile memory cell can be programmed without thenon-volatile memory cell being previously erased. Furthermore, thememory cells of the memory components 112 can be grouped as memory pagesor data blocks that can refer to a unit of the memory component used tostore data.

The controller 115 can communicate with the memory components 112 viathe sequencer component 140 to perform operations such as reading data,writing data, or erasing data at the memory components 112 and othersuch operations. In one example, the controller 115 can include an errorcomponent 116 with an encoder 118 and a decoder 121. In someembodiments, the error component 116 can be used to perform any suitableencoding and/or decoding error correction operations using the encoder118 and the decoder 121, respectively, for packages including sequencersthat lack error correction functionality. In some embodiments, the errorcomponent 116 can be used as a second level of error correction toprovide additional error correction functionality for data that ispartially corrected by a first level of error correction performed bythe error correction engine 141 of the sequencer component 140. In someembodiments, the error component 116 can encode a portion of datareceived from the host system 120 and transmit the partially encodeddata to the sequencer component 140 to enable the data to be completedencoded by the error correction engine 141. In some embodiments, thecontroller 115 can receive a notification that the sequencer component140 includes error correction functionality. In such an instance, thecontroller 115 can forward raw data received from the host system 120 tothe sequencer component 140. Raw data can refer to data that has not hadan error correction operation (e.g., encoding) applied.

If used, the error component 116 can perform an encoding errorcorrection operation that encodes raw data received by the host system120 with additional data bits (e.g., parity bits) to form a code word tobe written to the memory components 112 via the sequencer component 140.The error component 116 can also perform a decoding error correctionoperation that decodes the code word by removing the additional databits. The encoding/decoding operations can use certain configurationparameters that are based on the type of the memory components 112 onwhich the data is to be stored. The controller 115 can send one or morecode words to the sequencer component 140. The sequencer component 140can determine which portions of which code words to store on the memorycomponents 112A to 112N by considering the bandwidth and availability ofthe memory components 112A to 112N, timing requirements (e.g.,read/write latency) of the memory components 112A to 112N, and rulesregarding sequencing of read/write operations.

The controller 115 can include hardware such as one or more integratedcircuits and/or discrete components, a buffer memory, or a combinationthereof. The controller 115 can be a microcontroller, special purposelogic circuitry (e.g., a field programmable gate array (FPGA), anapplication specific integrated circuit (ASIC), etc.), or other suitableprocessor. The controller 115 can include a processor (processingdevice) 117 configured to execute instructions stored in local memory119. In the illustrated example, the local memory 119 of the controller115 includes an embedded memory configured to store instructions forperforming various processes, operations, logic flows, and routines thatcontrol operation of the memory sub-system 110, including handlingcommunications between the memory sub-system 110 and the host system120. In some embodiments, the local memory 119 can include memoryregisters storing memory pointers, fetched data, etc. The local memory119 can also include read-only memory (ROM) for storing micro-code.While the example memory sub-system 110 in FIG. 1 has been illustratedas including the controller 115, in another embodiment of the presentdisclosure, a memory sub-system 110 may not include a controller 115,and may instead rely upon external control (e.g., provided by anexternal host, or by a processor or controller separate from the memorysub-system).

In general, the controller 115 can receive commands or operations fromthe host system 120 and can convert the commands or operations intoinstructions or appropriate commands to achieve the desired access tothe memory components 112. In some embodiments, the controller 115 canalso perform address translations between a logical block address and aphysical block address that are associated with the memory components112. The controller 115 can also perform memory management operationssuch as determining a wear leveling scheme tailored for the memory typeof the memory components and issuing operations representing the wearleveling scheme to the sequencer component 140.

The controller 115 can be responsible for other operations, such asgarbage collection operations, encryption operations, and/or cachingoperations. The controller 115 can further include host interfacecircuitry to communicate with the host system 120 via the physical hostinterface. The host interface circuitry can convert the commandsreceived from the host system into command instructions to access thememory components 112 via the sequencer component 140, as well asconvert responses associated with the memory components 112 intoinformation for the host system 120.

The memory sub-system 110 can also include additional circuitry orcomponents that are not illustrated. In some embodiments, the memorysub-system 110 can include a cache or buffer (e.g., DRAM) and addresscircuitry (e.g., a row decoder and a column decoder) that can receive anaddress from the controller 115 and decode the address to access thememory components 112.

FIG. 2 is a flow diagram of an example method 200 for performing anencoding error correction operation on data in accordance with someembodiments of the present disclosure. The method 200 can be performedby processing logic that can include hardware (e.g., processing device,circuitry, dedicated logic, programmable logic, microcode, hardware of adevice, integrated circuit, etc.), software (e.g., instructions run orexecuted on a processing device), or a combination thereof. In someembodiments, the method 200 is performed by a processing device of thesequencer component 140 (e.g., the error correction engine 141) ofFIG. 1. Although shown in a particular sequence or order, unlessotherwise specified, the order of the processes can be modified. Thus,the illustrated embodiments should be understood only as examples, andthe illustrated processes can be performed in a different order, andsome processes can be performed in parallel. Additionally, one or moreprocesses can be omitted in various embodiments. Thus, not all processesare required in every embodiment. Other process flows are possible.

At block 210, the processing device of the sequencer component 140receives data from the controller 115 that is external to the sequencercomponent 140. The sequencer component 140 is included in the package130 that includes the memory component 112A, and the controller 115 isexternal to the package 130. The data received from the controller 115can be sent to the controller 115 by the host system 120 as raw data(e.g., data from the host system 120 that is not encoded) and the hostsystem 120 can specify that the data is to be written to the memorycomponents 112. In some embodiments, prior to receiving the data, theprocessing device of the sequencer component 140 can transmit anotification to the controller 115 that indicates that the sequencercomponent 140 includes functionality to perform error correctionoperations. The notification can cause the controller 115 to transmitraw data to the sequencer component 140 that is external to the memorycontroller 115 without performing an encoding operation on the raw dataat the controller 115. In some embodiments, where the controller 115 andthe sequencer 140 coordinate to perform error correction operations, thecontroller 115 can partially encode the data and the processing deviceof the sequencer component 140 can fully encode the partially encodeddata received from the controller 115.

At block 220, the processing device of the sequencer component 140performs an error correction operation on the data received from thecontroller 115. The error correction operation may be an encoding errorcorrection operation that encodes raw data or partially encoded datareceived from the controller 115 with additional data bits (e.g., paritybits) to generate a code word. The processing device can receive anindication of a memory type of the memory component 112A. The memorytype can correspond to a structure (e.g., cross-point, flash, etc.) ofthe memory component 112A. The encoding error correction operation canuse certain configuration parameters that are based on the memory typeof the memory component 112A at which the code word is to be stored. Forexample, a size of the code word, a rate of the code word, and/or a typeof the code word can be selected based on the memory type of the memorycomponent 112A.

In some embodiments, a maximum distance separable code, such as a ReedSolomon code, can be used for the encoding error correction operation. AReed Solomon code encodes a block of data by adding extra redundant bitsto the data. For example, k data symbols of s bits each can be encodedinto an n symbol code word with parity symbols added to the k datasymbols. A mathematical operation (e.g., polynomial) can be generatedbased on the block of data and the parity bits can be obtained using themathematical operation. The parity bits can be added to the block ofdata.

Various reasons (e.g., noisy communication, memory component failure,asynchronous power loss, etc.) can cause the data of the code word toinclude errors (e.g., flipped bits, lost bits, etc.). If there areerrors in the code word stored at the memory component 112A or memorycomponents 112A-112N, the parity bits or other bits of the code word canbe used in the original mathematical operation to obtain the originalblock of data and/or the parity bits and correct the errors in the codeword.

At block 230, the processing device of the sequencer component 140stores the code word at the memory component 112A coupled to thesequencer component 140. In some embodiments, there may be numerousmemory components 112A-112N coupled to the sequencer component 140. Theprocessing device can determine one or more of the memory components112A-112N to store the code word at based on bandwidth of the memorycomponents 112A-112N, available storage of the memory components112A-112N, wear leveling, etc. For example, the processing device canstripe the code word across more than one memory component 112A-112N todistribute the code word, which may enable certain techniques such asredundant array of independent disks.

FIG. 3 is a flow diagram of an example method 300 for performing adecoding error correction operation on data in accordance with someembodiments of the present disclosure. The method 300 can be performedby processing logic that can include hardware (e.g., processing device,circuitry, dedicated logic, programmable logic, microcode, hardware of adevice, integrated circuit, etc.), software (e.g., instructions run orexecuted on a processing device), or a combination thereof. In someembodiments, the method 300 is performed by a processing device of thesequencer component 140 (e.g., error correction engine 141) of FIG. 1.Although shown in a particular sequence or order, unless otherwisespecified, the order of the processes can be modified. Thus, theillustrated embodiments should be understood only as examples, and theillustrated processes can be performed in a different order, and someprocesses can be performed in parallel. Additionally, one or moreprocesses can be omitted in various embodiments. Thus, not all processesare required in every embodiment. Other process flows are possible.

At block 310, the processing device of a sequencer component 140receives an operation to read the data (e.g., code word) that is storedat the memory component 112A. The operation can be sent by the hostsystem 120 to the controller 115, and the controller 115 can send theoperation to the processing device of the sequencer component 140.

At block 320, the processing device of the sequencer component 140, inresponse to receiving the operation, retrieves the code word from thememory component 112A or memory components 112A-112N.

At block 330, the processing device of the sequencer component 140performs a decoding operation associated with the code word to generatethe data. In some embodiments, the decoding operation can includeapplying an error correction code to the code word to attempt to decodethe code word (e.g., removing the parity bits) and/or fix one or morebit errors. For example, applying the error correction code to the datastored on the memory component 112A or the memory components 112A-112Ncan result in obtaining an updated data including at least one correctedbit. If a Reed Solomon code is used, a mathematical operation (e.g.,polynomial) that was used to encode the code word can be used with oneor more original bits and/or parity bits of the code word to obtain acorrect bit to which to change the bit including the error.

In some embodiments, the processing device of the sequencer component140 can identify that a portion of the data includes a first error thatcannot be decoded by the decoding operation that is performed by thesequencer component 140. The decoding operation may have corrected oneor more other errors, but the portion of data may still include at leastone other error. Accordingly, the processing device can perform anothererror correction operation (e.g., error correction code, redundancyoperation, etc.) on the data including the portion. Performing multiplereads of the data can enable the processing device to obtain informationthat indicates whether values of the data are trustable (e.g., returnsthe same value each read), experienced a flipping (e.g., moving the readvoltage level shows the value changes), or are an error (e.g., wrongvalue). As previously discussed, due to the proximity of the sequencercomponent 140 to the memory component 112A in the package 130, thetraces between the sequencer component 140 and the memory component 112Aare short, thereby reducing power consumption and improving read latencyduring decoding. Thus, including a sequencer component 140 that performserror correction operations in a package 130 with a memory component112A can improve the performance of a memory sub-system 110.

In some embodiments, when the processing device of the sequencercomponent 140 identifies that a portion of the data includes an errorthat cannot be decoded by the decoding operation that is performed bythe sequencer component 140, the processing device can transmit the datato the controller 115 to cause the controller 115 to decode at least theportion of the data to correct the error that cannot be decoded by thedecoding operation performed by the sequencer component 140. The datacan include at least one corrected bit as a result of the decodingoperation performed by the sequencer component 140. In this embodiment,the decoding operation performed by the sequencer component 140 canrepresent a first level of error correction and the decoding operationperformed by the controller 115 can represent a second level of errorcorrection. The error correction operations may or may not use anyinformation related to the error bit location. In some embodiments, thefirst level of error correction performed by the sequencer component 140can be stronger than the second level of error correction performed bythe controller 115. That is, the first level of error correction canusually correct more errors than the second level of error correction.For example, the first level of error correction can correct a firstnumber of bits (e.g., 20) out of a 128 byte code word, and the secondlevel of error correction can correct a second number of bits (e.g., 1symbol) fewer than the first number of bits. In any embodiment, when thecode word is decoded and the original data is obtained, the originaldata can be transmitted to the host system 120.

FIG. 4 is a flow diagram of an example method 400 for performing a testof a memory component 112A in accordance with some embodiments of thepresent disclosure. The method 400 can be performed by processing logicthat can include hardware (e.g., processing device, circuitry, dedicatedlogic, programmable logic, microcode, hardware of a device, integratedcircuit, etc.), software (e.g., instructions run or executed on aprocessing device), or a combination thereof. In some embodiments, themethod 400 is performed by a processing device of the sequencercomponent 140 (e.g., memory test engine 145) of FIG. 1. Although shownin a particular sequence or order, unless otherwise specified, the orderof the processes can be modified. Thus, the illustrated embodimentsshould be understood only as examples, and the illustrated processes canbe performed in a different order, and some processes can be performedin parallel. Additionally, one or more processes can be omitted invarious embodiments. Thus, not all processes are required in everyembodiment. Other process flows are possible.

At block 410, the processing device of the sequencer component 140generates a testing pattern to perform a test of the memory component.The sequencer component 140 resides in a package 130 that is separatefrom the controller 115. The testing pattern can correspond to read,write, and/or erase operations on data at the memory component 112A. Theprocessing device can generate the pattern of operations to perform, aswell as the data that is to be written to and/or read from the memorycomponent 112A. Certain memory types of memory components 112A can beassociated with certain issues (e.g., bridging issues). The processingdevice can receive an indication of the memory type of the memorycomponent 112A and tailor the testing pattern based on the memory typeto test the known issues.

The testing pattern can be designed to test that the memory component112A functions properly (e.g., stores the data correctly and providesthe data correctly) at certain temperatures. The temperatures can beselected based on design specifications for the memory component 112A inview of the memory type of the memory components 112A. The testingpattern can use a specific amount or order of operations to be performedto cause the memory component 112A to reach the various temperaturesduring operation. Further, various different voltages can be used duringthe tests to evaluate whether the memory components functions properlywhen differing voltages are applied. Such temperature and/or voltagestress testing can provide an indication of the endurance of the memorycomponent 112A.

In some embodiments, the testing pattern can stress test timingrequirements (e.g., a timing window) associated with the memorycomponent 112A via an interface between the sequencer component 140 andthe memory component 112A. The timing requirements can specify an amountof time the memory component 112A has to transmit signals and/or performoperations. Testing the timing requirements can ensure that the memorycomponent 112A meets certain responsivity standards associated with thememory type of the memory components 112A, and can ensure that thememory component 112A is compatible with the controller 115 with whichthe memory component 112A is to operate. In some embodiments, thetesting pattern can be generated to stress test the timing requirementsat the different temperatures and/or at the different voltages.

At block 420, the processing device of the sequencer component 140performs the testing pattern to write the data at the memory component112A. As discussed above, in some embodiments, the testing pattern caninclude any suitable pattern of operations (e.g., write, read, erase,etc.) and data that are determined to be useful in testing one or moreaspects of the memory component 112A.

At block 430, the processing device of the sequencer component 140retrieves the data from the memory component 112A. The processing devicecan retrieve the data by reading the data from the memory component112A. In some instances, the data can include one or more errors (e.g.,flipped bit, erased bit, etc.). The processing device of the sequencercomponent 140 executing the memory test engine 145 can program memoryparameters, such as the read level voltages to attempt to re-read thedata using the modified read level voltage. In some embodiments, usingthe different read level voltage can return the data without errors. Ifthe data still contains one or more errors, the processing device canuse the error correction engine 141 of the sequencer component 140 toattempt to correct the errors. The error correction engine 141 canperform one or more error correction operations to the data of thetesting pattern written to the memory component 112A and return thecorrected data to the memory test engine 145.

At block 440, the processing device of the sequencer component 140compares the retrieved data to the data of the testing pattern writtento the memory component 112A. The processing device of the sequencercomponent 140 executing the comparator 147 can compare the retrieveddata to the data of the testing pattern written to the memory component112A.

At block 450, the processing device of the sequencer component 140determines whether the test of the memory component 112A successfullycompleted based on the comparison of the retrieved data to the data ofthe testing pattern. For example, if the retrieved data matches the datawritten of the testing pattern written to the memory component 112A, theprocessing device can determine that the test successfully completed(e.g., the memory component 112A functioned as expected). Responsive todetermining that the test of the memory component 112A successfullycompleted, the processing device can transmit a notification indicatingthat the test successfully completed. If the retrieved data does notmatch the data of the testing pattern written to the memory component112A, the processing device can determine that the test did notsuccessfully complete. Responsive to determining that the test of thememory component 112A did not successfully complete, the processingdevice can transmit a notification indicating that the test did notsuccessfully completed.

Embedding the memory test engine 145 within the sequencer component 140in an individual package 130 that includes the memory components112A-112N can reduce the complexity and cost associated with testing thememory components 112A-112N. For example, separate boards that arespecific to the memory types of the memory components may not be neededbecause the memory test engine 145 generates the testing patternspecifically for the memory type of the memory components 112A-112Ncoupled to the sequencer component 140. Thus, the package 130 can beconnected to a memory-type agnostic board to test the memory componentsusing the memory test engine 145 of the sequencer component 140.Numerous different packages 130 including differing memory types ofmemory components can use the same memory-type agnostic board to runtheir respective tests.

FIG. 5 illustrates an example machine of a computer system 500 withinwhich a set of instructions, for causing the machine to perform any oneor more of the methodologies discussed herein, can be executed. In someembodiments, the computer system 500 can correspond to a host system(e.g., the host system 120 of FIG. 1) that includes, is coupled to, orutilizes a memory sub-system (e.g., the memory sub-system 110 of FIG. 1)or can be used to perform the operations of a controller or to performthe operations of a sequencer component 140 (e.g., to perform operationscorresponding to the error correction engine 141 and/or the memory testengine 145 of FIG. 1). In alternative embodiments, the machine can beconnected (e.g., networked) to other machines in a LAN, an intranet, anextranet, and/or the Internet. The machine can operate in the capacityof a server or a client machine in client-server network environment, asa peer machine in a peer-to-peer (or distributed) network environment,or as a server or a client machine in a cloud computing infrastructureor environment.

The machine can be a personal computer (PC), a tablet PC, a set-top box(STB), a Personal Digital Assistant (PDA), a cellular telephone, a webappliance, a server, a network router, a switch or bridge, or anymachine capable of executing a set of instructions (sequential orotherwise) that specify actions to be taken by that machine. Further,while a single machine is illustrated, the term “machine” shall also betaken to include any collection of machines that individually or jointlyexecute a set (or multiple sets) of instructions to perform any one ormore of the methodologies discussed herein.

The example computer system 500 includes a processing device 502, a mainmemory 504 (e.g., read-only memory (ROM), flash memory, dynamic randomaccess memory (DRAM) such as synchronous DRAM (SDRAM) or Rambus DRAM(RDRAM), etc.), a static memory 506 (e.g., flash memory, static randomaccess memory (SRAM), etc.), and a data storage system 518, whichcommunicate with each other via a bus 530.

Processing device 502 represents one or more general-purpose processingdevices such as a microprocessor, a central processing unit, or thelike. More particularly, the processing device can be a complexinstruction set computing (CISC) microprocessor, reduced instruction setcomputing (RISC) microprocessor, very long instruction word (VLIW)microprocessor, or a processor implementing other instruction sets, orprocessors implementing a combination of instruction sets. Processingdevice 502 can also be one or more special-purpose processing devicessuch as an application specific integrated circuit (ASIC), a fieldprogrammable gate array (FPGA), a digital signal processor (DSP),network processor, or the like. The processing device 602 is configuredto execute instructions 526 for performing the operations and stepsdiscussed herein. The computer system 500 can further include a networkinterface device 508 to communicate over the network 520.

The data storage system 518 can include a machine-readable storagemedium 524 (also known as a computer-readable medium) on which is storedone or more sets of instructions 526 or software embodying any one ormore of the methodologies or functions described herein. Theinstructions 526 can also reside, completely or at least partially,within the main memory 504 and/or within the processing device 502during execution thereof by the computer system 500, the main memory 504and the processing device 502 also constituting machine-readable storagemedia. The machine-readable storage medium 524, data storage system 518,and/or main memory 504 can correspond to the memory sub-system 110 ofFIG. 1.

In one embodiment, the instructions 526 include instructions toimplement functionality corresponding to an error correction engine 141and/or a memory test engine 145 of the sequencer component 140 ofFIG. 1. While the machine-readable storage medium 524 is shown in anexample embodiment to be a single medium, the term “machine-readablestorage medium” should be taken to include a single medium or multiplemedia that store the one or more sets of instructions. The term“machine-readable storage medium” shall also be taken to include anymedium that is capable of storing or encoding a set of instructions forexecution by the machine and that cause the machine to perform any oneor more of the methodologies of the present disclosure. The term“machine-readable storage medium” shall accordingly be taken to include,but not be limited to, solid-state memories, optical media, and magneticmedia.

Some portions of the preceding detailed descriptions have been presentedin terms of algorithms and symbolic representations of operations ondata bits within a computer memory. These algorithmic descriptions andrepresentations are the ways used by those skilled in the dataprocessing arts to most effectively convey the substance of their workto others skilled in the art. An algorithm is here, and generally,conceived to be a self-consistent sequence of operations leading to adesired result. The operations are those requiring physicalmanipulations of physical quantities. Usually, though not necessarily,these quantities take the form of electrical or magnetic signals capableof being stored, combined, compared, and otherwise manipulated. It hasproven convenient at times, principally for reasons of common usage, torefer to these signals as bits, values, elements, symbols, characters,terms, numbers, or the like.

It should be borne in mind, however, that all of these and similar termsare to be associated with the appropriate physical quantities and aremerely convenient labels applied to these quantities. The presentdisclosure can refer to the action and processes of a computer system,or similar electronic computing device, that manipulates and transformsdata represented as physical (electronic) quantities within the computersystem's registers and memories into other data similarly represented asphysical quantities within the computer system memories or registers orother such information storage systems.

The present disclosure also relates to an apparatus for performing theoperations herein. This apparatus can be specially constructed for theintended purposes, or it can include a general purpose computerselectively activated or reconfigured by a computer program stored inthe computer. Such a computer program can be stored in a computerreadable storage medium, such as, but not limited to, any type of diskincluding floppy disks, optical disks, CD-ROMs, and magnetic-opticaldisks, read-only memories (ROMs), random access memories (RAMs), EPROMs,EEPROMs, magnetic or optical cards, or any type of media suitable forstoring electronic instructions, each coupled to a computer system bus.

The algorithms and displays presented herein are not inherently relatedto any particular computer or other apparatus. Various general purposesystems can be used with programs in accordance with the teachingsherein, or it can prove convenient to construct a more specializedapparatus to perform the method. The structure for a variety of thesesystems will appear as set forth in the description below. In addition,the present disclosure is not described with reference to any particularprogramming language. It will be appreciated that a variety ofprogramming languages can be used to implement the teachings of thedisclosure as described herein.

The present disclosure can be provided as a computer program product, orsoftware, that can include a machine-readable medium having storedthereon instructions, which can be used to program a computer system (orother electronic devices) to perform a process according to the presentdisclosure. A machine-readable medium includes any mechanism for storinginformation in a form readable by a machine (e.g., a computer). In someembodiments, a machine-readable (e.g., computer-readable) mediumincludes a machine (e.g., a computer) readable storage medium such as aread only memory (“ROM”), random access memory (“RAM”), magnetic diskstorage media, optical storage media, flash memory components, etc.

In the foregoing specification, embodiments of the disclosure have beendescribed with reference to specific example embodiments thereof. Itwill be evident that various modifications can be made thereto withoutdeparting from the broader spirit and scope of embodiments of thedisclosure as set forth in the following claims. The specification anddrawings are, accordingly, to be regarded in an illustrative senserather than a restrictive sense.

What is claimed is:
 1. A method comprising: receiving, by a processingdevice of a sequencer component, data from a controller that is externalto the sequencer component; performing, by the processing device of thesequencer component, an error correction operation on the data receivedfrom the controller that is external to the sequencer component togenerate a code word associated with the data; and storing the code wordat a memory component coupled with the sequencer component.
 2. Themethod of claim 1, further comprising: receiving an indication of amemory type of the memory component, the memory type corresponding to astructure of the memory component, wherein performing the errorcorrection operation to generate the code word is based on the memorytype of the memory component.
 3. The method of claim 1, furthercomprising: receiving an operation to read the data; in response toreceiving the operation, retrieving the code word from the memorycomponent; and performing, by the processing device of the sequencercomponent, a decoding operation associated with the code word togenerate the data.
 4. The method of claim 3, further comprising:identifying that a portion of the data includes a first error thatcannot be decoded by the decoding operation that is performed by thesequencer component, wherein decoding the data corrected at least asecond error in the data; and performing, by the processing device ofsequencer component, a second error correction operation to decode theportion of the data to correct the first error.
 5. The method of claim3, further comprising: identifying that a portion of the data includes afirst error that cannot be decoded by the decoding operation that isperformed by the sequencer component, wherein the decoding operationcorrects at least a second error in the data; and transmitting the datato the controller to cause the controller to decode at least the portionof the data to correct the first error that cannot be decoded by thedecoding operation performed by the sequencer component.
 6. The methodof claim 1, further comprising: prior to receiving the data,transmitting, by the sequencer component, a notification to thecontroller that indicates that the sequencer component includesfunctionality to perform the error correction operation to cause thecontroller to transmit raw data to the sequencer component that isexternal to the controller without performing an encoding operation onthe raw data at the controller.
 7. The method of claim 1, wherein thesequencer component is included in a package that includes the memorycomponent, and wherein the controller is external to the package.
 8. Asystem comprising: a memory component; and a processing device of asequencer component, operatively coupled with the memory component, to:receive data from a controller that is external to the sequencercomponent; perform an error correction operation on the data receivedfrom the controller that is external to the sequencer component togenerate a code word associated with the data; and store the code wordat the memory component operatively coupled with the processing deviceof the sequencer component.
 9. The system of claim 8, wherein thesequencer component is included in a package that includes the memorycomponent, and wherein the controller is external to the package. 10.The system of claim 8, wherein the processing device of the sequencercomponent is further to: receive an indication of a memory type of thememory component, the memory type corresponding to a structure of thememory component, wherein performing the error correction operation togenerate the code word is based on the memory type of the memorycomponent.
 11. The system of claim 8, wherein the processing device ofthe sequencer component is further to: receive an operation to read thedata; in response to receiving the operation, retrieve the code wordfrom the memory component; and perform a decoding operation associatedwith the code word to generate the data.
 12. The system of claim 11,wherein the processing device of the sequencer component is further to:identify that a portion of the data includes a first error that cannotbe decoded by the decoding operation that is performed by the sequencercomponent, wherein decoding the data corrected at least a second errorin the data; and perform a second error correction operation to decodethe portion of the data to correct the first error.
 13. The system ofclaim 11, wherein the processing device of the sequencer component isfurther to: identify that a portion of the data includes a first errorthat cannot be decoded by the decoding operation that is performed bythe sequencer component, wherein the decoding operation corrects atleast a second error in the data; and transmit the data to thecontroller to cause the controller to decode at least the portion of thedata to correct the first error that cannot be decoded by the decodingoperation performed by the sequencer component.
 14. The system of claim8, wherein the processing device of the sequencer component is furtherto: prior to receiving the data, transmit a notification to thecontroller that indicates that the sequencer component includesfunctionality to perform the error correction operation to cause thecontroller to transmit raw data to the sequencer component that isexternal to the controller without performing an encoding operation onthe raw data at the controller.
 15. A method comprising: generating, bya processing device of a sequencer component, a testing pattern toperform a test of the memory component, wherein the testing patterncorresponds to a plurality of operations to write data at the memorycomponent, and wherein the sequencer component resides in a package thatis separate from a controller; performing the testing pattern to writethe data at the memory component; retrieving the data from the memorycomponent; comparing the retrieved data to the data of the testingpattern written to the memory component; and determining whether thetest of the memory component successfully completed based on thecomparison of the retrieved data to the data of the testing pattern. 16.The system of claim 15, wherein performing the testing pattern causesthe memory component to operate at a plurality of differenttemperatures.
 17. The system of claim 15, wherein the testing pattern isperformed using a plurality of different voltages.
 18. The system ofclaim 15, wherein the testing pattern stress tests timing requirementsfor transmitting, via an interface between the sequencer component andthe memory component, signals from the sequencer component to the memorycomponent.
 19. The system of claim 15, wherein the processing device isfurther to modify a read voltage level to be applied when reading thesecond data from the memory component.
 20. The system of claim 15,wherein the processing device is further to: responsive to determiningthat the test of the memory component successfully completed, transmit anotification indicating that the test successfully completed; orresponsive to determining that the test of the memory component did notsuccessfully complete, transmit a notification indicating that the testdid not successfully complete.